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Bonding: Revision history

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5 June 2024

  • curprev 06:5606:56, 5 June 2024‎ Dank talk contribs‎ 407 bytes +22‎ No edit summary
  • curprev 05:0405:04, 5 June 2024‎ Dank talk contribs‎ 385 bytes +25‎ No edit summary
  • curprev 05:0305:03, 5 June 2024‎ Dank talk contribs‎ 360 bytes +360‎ Created page with "Bonding refers to combining multiple NICs into a single logical NIC, with a consequent increase in redundancy and/or throughput, and possibly a reduction in latency. Improvements to throughput and latency will generally require either parallelism among flows, or interleaving packets from a single flow; this last is likely to introduce reordering to the flow."
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