Winbond: Difference between revisions
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==[https://www.winbond.com/resource-files/w25n01gv%20revg%20032116.pdf W25N01GV]== | ==[https://www.winbond.com/resource-files/w25n01gv%20revg%20032116.pdf W25N01GV]== | ||
A 1Gb (128MB) Quad-SPI SLC NAND chip of 1K 128KB blocks (each made up of 64 ECC-protected 2KB pages), capable of up to 104MHz Quad-SPI. Each page, in addition to the 2048 usable bytes, contains a 64-byte "Spare Area". When on-device ECC is enabled, the majority of the Spare Area is used for ECC and bad block marking, though 2 unprotected and 4 ECC-protected bits are available to the user in each of 4 16-byte lines. When on-device ECC is disabled, the 64 bytes of the Spare Area are available to the user. The serial NAND employs 32-bit addresses: the four MSB are unused, 10 bits select the block, 6 bits select the page, and the 12 LSB specify the byte. | A 1Gb (128MB) Quad-SPI SLC NAND chip of 1K 128KB blocks (each made up of 64 ECC-protected 2KB pages), capable of up to 104MHz Quad-SPI. Each page, in addition to the 2048 usable bytes, contains a 64-byte "Spare Area". Writes load 2,112 bytes. When on-device ECC is enabled, the majority of the Spare Area is used for ECC and bad block marking, though 2 unprotected and 4 ECC-protected bits are available to the user in each of 4 16-byte lines. When on-device ECC is disabled, the 64 bytes of the Spare Area are available to the user. The serial NAND employs 32-bit addresses: the four MSB are unused, 10 bits select the block, 6 bits select the page, and the 12 LSB specify the byte. | ||
Packagings include: | Packagings include: | ||