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Bonding: Difference between revisions
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(Created page with "Bonding refers to combining multiple NICs into a single logical NIC, with a consequent increase in redundancy and/or throughput, and possibly a reduction in latency. Improvements to throughput and latency will generally require either parallelism among flows, or interleaving packets from a single flow; this last is likely to introduce reordering to the flow.") |
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Bonding refers to combining multiple NICs into a single logical NIC, with a consequent increase in redundancy and/or throughput, and possibly a reduction in latency. Improvements to throughput and latency will generally require either parallelism among flows, or interleaving packets from a single flow; this last is likely to introduce reordering to the flow. | Bonding refers to combining multiple NICs into a single logical NIC, with a consequent increase in redundancy and/or throughput, and possibly a reduction in latency. Improvements to throughput and latency will generally require either parallelism among flows, or interleaving packets from a single flow; this last is likely to introduce reordering to the flow. | ||
[[CATEGORY:Networking]] | |||
Revision as of 05:04, 5 June 2024
Bonding refers to combining multiple NICs into a single logical NIC, with a consequent increase in redundancy and/or throughput, and possibly a reduction in latency. Improvements to throughput and latency will generally require either parallelism among flows, or interleaving packets from a single flow; this last is likely to introduce reordering to the flow.
