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Microarchitectures: Difference between revisions
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| Introduced protected mode/MMU | | Introduced protected mode/MMU | ||
Used in the IBM AT-5170 | Used in the IBM AT-5170 | ||
|- | |||
| 80386-DX | |||
| Intel | |||
| 1985 | |||
| CHMOS III 1.5 µm<br/>CHMOS IV 1 µm | |||
| 132-pin PGA<br/>132-pin PQFP | |||
| 32/32 | |||
| 32 | |||
| 12--33 MHz | |||
| x86-32 | |||
| Introduced paging, VM86, flat memory<br/>Optional 80287 or 80387 FP | |||
|- | |- | ||
|} | |} |
Revision as of 17:36, 20 January 2011
Microarchitecture is defined as those elements of a CPU design which are, to first order, invisible to application programmers (ie, not part of the instruction set). Those elements which are visible comprise the architecture.
x86 μarchitectures
FIXME: add early clones (NEC V20/V30, etc), AMD, VIA, Cyrix etc...
FIXME: add variants (80188, etc)
Name | Maker | Date | Process (min) | Package | ALU/data bits | Addr bits | Clock(s) | ISA | Notes |
---|---|---|---|---|---|---|---|---|---|
8086 | Intel | 1978 | 3.2 μm | 40-pin DIP | 16 | 20 | 4.77--10 MHz | x86-16 | Segmented memory
Optional 80-bit 8087 FP coprocessor |
8088 | Intel | 1979 | 3.2 μm (?) | 40-pin DIP
44-pin PLCC |
16/8 | 20 | 4.77--10 MHz | x86-16 | Designed for use with 8-bit externals
Used in IBM PC-5150 / XT-5160 / PCjr-4860 |
80186 | Intel | 1982 | 2.6 μm | 68-pin PLCC 68-pin PGA 100-pin PQFP |
16 | 20 | 6--25 MHz | 8086-2 | Designed for embedded systems (clock, PIC, DMA on-die) |
80286 | Intel | 1982 | 1.5 μm | 68-pin PGA 68-pin CLCC 68-pin PLCC |
16 | 24 | 4--12.5 MHz | 8086-2 | Introduced protected mode/MMU
Used in the IBM AT-5170 |
80386-DX | Intel | 1985 | CHMOS III 1.5 µm CHMOS IV 1 µm |
132-pin PGA 132-pin PQFP |
32/32 | 32 | 12--33 MHz | x86-32 | Introduced paging, VM86, flat memory Optional 80287 or 80387 FP |
Instruction sets
- x86-16: The granddaddy of 'em all
- 8086-2: Added ENTER/LEAVE, PUSHA/POPA, INS/OUTS
Physical Packages
- DIP (dual in-line package): 2 parallel rows of pins
- PGA (pin grid array): Regularly-spaced pins in rectangular geometry
- CLCC (ceramic leadless chip carrier): Regularly-spaced metallized castellations in rectangular geometry
- PLCC (plastic lead chip carrier): Regularly-spaced J-leads in rectangular geometry, surface- or package-mounted
References
- A CPU History, David Risley, PCMECH, 2001-03-23
- An Outline of Developments in Intel CPU Architecture, Benjamin MJ Hodgson, University of Southampton, 2007-03-14
- The Red Hill CPU Guide, Red Hill Technology
- Intel 80286 Programmer's Reference Manual, Intel, 1987
- 80186 AMD Datasheet, Advanced Micro Devices, 1991-11-01
- Hermetic Package information, Intersil
- Packages, Evergreen Semiconductor Materials