Winbond: Difference between revisions
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===[https://www.winbond.com/resource-files/w25n01gv%20revg%20032116.pdf W25N01GVxxIG/IT]=== | ===[https://www.winbond.com/resource-files/w25n01gv%20revg%20032116.pdf W25N01GVxxIG/IT]=== | ||
A 1Gb (128MB) Quad-SPI SLC NAND chip of 1K 128KB blocks (each made up of 64 ECC-protected 2KB pages), capable of up to 104MHz Quad-SPI. Each page, in addition to the 2048 usable bytes, contains a 64-byte "Spare Area". Writes load 2,112 bytes. When on-device ECC is enabled, the majority of the Spare Area is used for ECC and bad block marking, though 2 unprotected and 4 ECC-protected | A 1Gb (128MB) Quad-SPI SLC NAND chip of 1K 128KB blocks (each made up of 64 ECC-protected 2KB pages), capable of up to 104MHz Quad-SPI. Each page, in addition to the 2048 usable bytes, contains a 64-byte "Spare Area". Writes load 2,112 bytes. When on-device ECC is enabled, the majority of the Spare Area is used for ECC and bad block marking, though 2 unprotected and 4 ECC-protected bytes are available to the user in each of 4 16-byte lines. When on-device ECC is disabled, the 64 bytes of the Spare Area are available to the user. The serial NAND employs 32-bit addresses: the four MSB are unused, 10 bits select the block, 6 bits select the page, and the 12 LSB specify the byte. The device also provides a 20-entry LUT for mapping logical page addresses away to undamaged physical page addresses (the manufacturer might set some of these entries at the factory). | ||
The xx refers to the package code. The IT part sets the BUF mode selector to 0 on initialization. The IG part sets BUF to 1. Both allow the mode to be configured by writing to the BUF bit of the Configuration Register. | The xx refers to the package code. The IT part sets the BUF mode selector to 0 on initialization. The IG part sets BUF to 1. Both allow the mode to be configured by writing to the BUF bit of the Configuration Register. | ||