Winbond

Winbond of Taiwan manufactures semiconductor devices, including flash storage.

W25N01GV

A 1Gb (128MB) Quad-SPI SLC NAND chip of 64K 2KB pages, capable of up to 104MHz Quad-SPI. Packagings include:

• 8-pad WSON 8x6mm (package code ZE)
• 16-pin SOIC 300-mil (package code SF)
• 1x4 + 4x5 24-ball 8x6mm TFBGA (package code TB)
• 4x6 24-ball 8x6mm TFBGA (package code TC)

Lines:

• CLK serial clock input
• /CS chip select input
• DI (IO0) data input / data io0
• DO (IO1) data output / data io1
• /WP (IO2) write protect input / data io2
• /HOLD (IO3) hold input / data io3
• VCC power (2.7V--3.6V)
• GND