Winbond

Winbond of Taiwan manufactures semiconductor devices, including flash storage.

W25N01GV

A 1Gb (128MB) Quad-SPI SLC NAND chip of 1K 128KB blocks (each made up of 64 ECC-protected 2KB pages), capable of up to 104MHz Quad-SPI. Each page, in addition to the 2048 usable bytes, contains a 64-byte "Spare Area". Writes load 2,112 bytes. When on-device ECC is enabled, the majority of the Spare Area is used for ECC and bad block marking, though 2 unprotected and 4 ECC-protected bits are available to the user in each of 4 16-byte lines. When on-device ECC is disabled, the 64 bytes of the Spare Area are available to the user. The serial NAND employs 32-bit addresses: the four MSB are unused, 10 bits select the block, 6 bits select the page, and the 12 LSB specify the byte.

Packagings include:

• 8-pad WSON 8x6mm (package code ZE)
• 16-pin SOIC 300-mil (package code SF)
• 1x4 + 4x5 24-ball 8x6mm TFBGA (package code TB)
• 4x6 24-ball 8x6mm TFBGA (package code TC)

Lines:

• CLK serial clock input
• /CS chip select input
  • High deselects the device, putting it into standby mode (reduced power consumption)
  • Transition to low places device into active mode
  • /CS must track VCC during initialization and shutdown

• DI (IO0) data input / data io0
• DO (IO1) data output / data io1
• /WP (IO2) write protect input / data io2
• /HOLD (IO3) hold input / data io3
• VCC power (2.7V--3.6V)
• GND

/WP and /HOLD are only for SPI/Dual-SPI (Quad-SPI uses data io 0--3). Data is always written on the rising edge of CLK, and read on the falling edge. SPI must write through DO and read through DI. Dual- and Quad-SPI treat data io pins as bidirectional.