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Winbond: Difference between revisions
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(Created page with "[https://www.winbond.com/hq/ Winbond] of Taiwan manufactures semiconductor devices, including flash storage. ==[https://www.winbond.com/resource-files/w25n01gv%20revg%2003211...") |
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==[https://www.winbond.com/resource-files/w25n01gv%20revg%20032116.pdf W25N01GV]== | ==[https://www.winbond.com/resource-files/w25n01gv%20revg%20032116.pdf W25N01GV]== | ||
A 1Gb (128MB) Quad-SPI SLC NAND chip of 64K 2KB pages, capable of up to 104MHz Quad-SPI. | A 1Gb (128MB) Quad-SPI SLC NAND chip of 64K 2KB pages, capable of up to 104MHz Quad-SPI. | ||
Packagings include: | |||
* 8-pad WSON 8x6mm (package code ZE) | |||
* 16-pin SOIC 300-mil (package code SF) | |||
* 1x4 + 4x5 24-ball 8x6mm TFBGA (package code TB) | |||
* 4x6 24-ball 8x6mm TFBGA (package code TC) | |||
Lines: | |||
* CLK serial clock input | |||
* /CS chip select input | |||
* DI (IO0) data input / data io0 | |||
* DO (IO1) data output / data io1 | |||
* /WP (IO2) write protect input / data io2 | |||
* /HOLD (IO3) hold input / data io3 | |||
* VCC power (2.7V--3.6V) | |||
* GND | |||
Revision as of 02:58, 29 March 2019
Winbond of Taiwan manufactures semiconductor devices, including flash storage.
W25N01GV
A 1Gb (128MB) Quad-SPI SLC NAND chip of 64K 2KB pages, capable of up to 104MHz Quad-SPI. Packagings include:
- 8-pad WSON 8x6mm (package code ZE)
- 16-pin SOIC 300-mil (package code SF)
- 1x4 + 4x5 24-ball 8x6mm TFBGA (package code TB)
- 4x6 24-ball 8x6mm TFBGA (package code TC)
Lines:
- CLK serial clock input
- /CS chip select input
- DI (IO0) data input / data io0
- DO (IO1) data output / data io1
- /WP (IO2) write protect input / data io2
- /HOLD (IO3) hold input / data io3
- VCC power (2.7V--3.6V)
- GND
