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Winbond

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Revision as of 02:58, 29 March 2019 by Dank (talk | contribs)

Winbond of Taiwan manufactures semiconductor devices, including flash storage.

W25N01GV

A 1Gb (128MB) Quad-SPI SLC NAND chip of 64K 2KB pages, capable of up to 104MHz Quad-SPI. Packagings include:

  • 8-pad WSON 8x6mm (package code ZE)
  • 16-pin SOIC 300-mil (package code SF)
  • 1x4 + 4x5 24-ball 8x6mm TFBGA (package code TB)
  • 4x6 24-ball 8x6mm TFBGA (package code TC)

Lines:

  • CLK serial clock input
  • /CS chip select input
  • DI (IO0) data input / data io0
  • DO (IO1) data output / data io1
  • /WP (IO2) write protect input / data io2
  • /HOLD (IO3) hold input / data io3
  • VCC power (2.7V--3.6V)
  • GND